Mesa de reparación BGA de alineación óptica automática

BGA rework station
April 01, 2025
Brief: Discover the Infrared BGA Rework Station DH-A2E, a high-performance automatic mobile phone repair machine designed for IC replacement and motherboard repairs. Featuring an optical alignment system, automatic disassembly, and precise temperature control, this rework station ensures professional-grade repairs with ease.
Related Product Features:
  • High-definition optical alignment system for precise chip mounting and guaranteed repair success.
  • Automatic disassembly, welding, and recovery with one-key operation for seamless repairs.
  • Three-temperature zone independent control for tackling various chip repair challenges.
  • Imported infrared wave light tube ensures fast heating and stable temperature for minimal motherboard deformation.
  • Touch screen operation with real-time data display and automatic analysis for user-friendly control.
  • Manual and automatic operation modes for flexible debugging and batch repairs.
  • Microcrystal panel preheating area prevents small devices from falling into the machine.
  • Suitable for a wide range of chip rework including POP, SOP, SOJ, QFP, QFN, BGA, and more.
Las preguntas:
  • What types of chips can the DH-A2E rework station handle?
    The DH-A2E is suitable for various chip types including POP, SOP, SOJ, QFP, QFN, BGA, PLCC, and SCPP, making it versatile for multiple repair needs.
  • How does the automatic optical alignment system improve repair success?
    The high-definition optical alignment system ensures precise chip mounting with a 0.01mm accuracy, significantly increasing the success rate of repairs.
  • What safety features does the DH-A2E rework station include?
    The station features electronic pressure induction protection, infrared induction protection (optional), and an emergency switch with automatic power-off for enhanced safety during operation.