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Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal

Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal

Nombre De La Marca: HXT
MOQ: 1
Precio: 5400
Detalles Del Embalaje: Embalaje al vacío más embalaje en caja de madera
Condiciones De Pago: T/T
Información detallada
Lugar de origen:
Cantón, China
Certificación:
CE
Capacidad máxima del depósito de líquido:
40 litros
Nombre del producto:
Máquina de limpieza de plantillas SMT
Uso:
Máquina removedora de pegamento, limpiador seguro ESD
Función:
Automático
Industria:
Limpiador de plantillas
Tipo:
Limpiador automático de plantillas
Capacidad de la fuente:
La capacidad de producción es de 50 unidades al mes.
Resaltar:

Explosion-Proof Pneumatic Stencil Cleaner

,

SMT Stencil Cleaning Machine

,

PCB Solder Paste Stencil Cleaner

Descripción de producto
High Pressure Automatic Pneumatic Stencil Cleaner with 4-Stage Filtration System – 360° Rotary Spray for Stencil, Misprint PCB Board & Scraper Cleaning
Product Introduction
  • The Pneumatic Stencil Cleaner is designed for the SMT (Surface Mount Technology) production line. It efficiently removes solder paste, red glue, flux, and other high‑viscosity residues from:
  • SMT stencils (laser‑cut, step, and frameless)
  • Misprinted PCB boards
  • Squeegees / scrapers (metal or polyurethane)
  • Copper screens, fixtures, pallets, and tooling
  • By operating entirely on compressed air, the machine eliminates electrical ignition risks, making it ideal for environments where safety is paramount.
Key Applications
  • SMT laser stencils / step stencils
  • Misprinted PCB assemblies
  • Printing squeegees (metal or rubber)
  • Copper screens and silk screens
  • Wave solder pallets, fixtures, and carriers
  • Components with residual high‑viscosity adhesives
Technical Specifications

Applicable steel mesh sizeb:

L750 × W750 × H40 (mm) [Extra large sizes need to be customized]

Overall dimensions :

L1000×W700×H1730 (mm)

Liquid tank maximum capacity

40 liters

Optimum liquid usage

30 liters

Cleaning method:

360°rotating double-sided isobaric spray roll high-pressure spray (cleaning + drying)

Cleaning time

2-5min(for reference only)

Drying time

2-5min(for reference only)

External air source

0.4~0.7 (Mpa)

Air consumption

400~600(L/Min)

Exhaust port size

Φ125×H25(mm)

Filtration system (first level)

First level filter: (filters impurities and labels)

Filtration system (secondary)

Secondary filter: (filters solder paste and rosin particles)

Filtration system (three levels)

Third level filter: 5㎛ filter element (filters solder paste and rosin particles)

Machine net weight:

about 210Kg

Machine Details
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal 0
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal 1
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal 2
Key Features
  • Fully Pneumatic Drive – No electrical connection required; powered solely by compressed air.
  • 360° High‑Pressure Rotary Spray – Ensures thorough cleaning of stencil apertures, PCB surfaces, and complex tooling.
  • Multi‑Stage Filtration System – Integrated 4‑stage filtration separates solder particles and contaminants, extending cleaning fluid life.
  • Versatile Solvent Compatibility – Works with IPA, water‑based cleaners, and solvent‑based solutions.
  • One‑Button Automatic Cycle – Combines washing, rinsing, and drying in a fully automatic sequence.
Applicable Industries
  • Electronics Manufacturing Services (EMS)
  • Consumer electronics (smartphones, tablets, home appliances)
  • Automotive electronics (PCBs requiring high reliability)
  • Medical device manufacturing (strict cleanliness standards)
  • Aerospace & defense (explosion‑proof environments)
  • SMT contract manufacturers
  • Semiconductor packaging (post‑solder‑printing cleaning)
Buen precio  en línea

Detalles De Los Productos

Hogar > Productos >
maquinaria de la producción de la electrónica
>
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal

Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal

Nombre De La Marca: HXT
MOQ: 1
Precio: 5400
Detalles Del Embalaje: Embalaje al vacío más embalaje en caja de madera
Condiciones De Pago: T/T
Información detallada
Lugar de origen:
Cantón, China
Nombre de la marca:
HXT
Certificación:
CE
Capacidad máxima del depósito de líquido:
40 litros
Nombre del producto:
Máquina de limpieza de plantillas SMT
Uso:
Máquina removedora de pegamento, limpiador seguro ESD
Función:
Automático
Industria:
Limpiador de plantillas
Tipo:
Limpiador automático de plantillas
Cantidad de orden mínima:
1
Precio:
5400
Detalles de empaquetado:
Embalaje al vacío más embalaje en caja de madera
Tiempo de entrega:
10-15 días
Condiciones de pago:
T/T
Capacidad de la fuente:
La capacidad de producción es de 50 unidades al mes.
Resaltar:

Explosion-Proof Pneumatic Stencil Cleaner

,

SMT Stencil Cleaning Machine

,

PCB Solder Paste Stencil Cleaner

Descripción de producto
High Pressure Automatic Pneumatic Stencil Cleaner with 4-Stage Filtration System – 360° Rotary Spray for Stencil, Misprint PCB Board & Scraper Cleaning
Product Introduction
  • The Pneumatic Stencil Cleaner is designed for the SMT (Surface Mount Technology) production line. It efficiently removes solder paste, red glue, flux, and other high‑viscosity residues from:
  • SMT stencils (laser‑cut, step, and frameless)
  • Misprinted PCB boards
  • Squeegees / scrapers (metal or polyurethane)
  • Copper screens, fixtures, pallets, and tooling
  • By operating entirely on compressed air, the machine eliminates electrical ignition risks, making it ideal for environments where safety is paramount.
Key Applications
  • SMT laser stencils / step stencils
  • Misprinted PCB assemblies
  • Printing squeegees (metal or rubber)
  • Copper screens and silk screens
  • Wave solder pallets, fixtures, and carriers
  • Components with residual high‑viscosity adhesives
Technical Specifications

Applicable steel mesh sizeb:

L750 × W750 × H40 (mm) [Extra large sizes need to be customized]

Overall dimensions :

L1000×W700×H1730 (mm)

Liquid tank maximum capacity

40 liters

Optimum liquid usage

30 liters

Cleaning method:

360°rotating double-sided isobaric spray roll high-pressure spray (cleaning + drying)

Cleaning time

2-5min(for reference only)

Drying time

2-5min(for reference only)

External air source

0.4~0.7 (Mpa)

Air consumption

400~600(L/Min)

Exhaust port size

Φ125×H25(mm)

Filtration system (first level)

First level filter: (filters impurities and labels)

Filtration system (secondary)

Secondary filter: (filters solder paste and rosin particles)

Filtration system (three levels)

Third level filter: 5㎛ filter element (filters solder paste and rosin particles)

Machine net weight:

about 210Kg

Machine Details
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal 0
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal 1
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal 2
Key Features
  • Fully Pneumatic Drive – No electrical connection required; powered solely by compressed air.
  • 360° High‑Pressure Rotary Spray – Ensures thorough cleaning of stencil apertures, PCB surfaces, and complex tooling.
  • Multi‑Stage Filtration System – Integrated 4‑stage filtration separates solder particles and contaminants, extending cleaning fluid life.
  • Versatile Solvent Compatibility – Works with IPA, water‑based cleaners, and solvent‑based solutions.
  • One‑Button Automatic Cycle – Combines washing, rinsing, and drying in a fully automatic sequence.
Applicable Industries
  • Electronics Manufacturing Services (EMS)
  • Consumer electronics (smartphones, tablets, home appliances)
  • Automotive electronics (PCBs requiring high reliability)
  • Medical device manufacturing (strict cleanliness standards)
  • Aerospace & defense (explosion‑proof environments)
  • SMT contract manufacturers
  • Semiconductor packaging (post‑solder‑printing cleaning)