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Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

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+86 16620793861

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Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Nombre De La Marca:	HXT
Número De Modelo:	DH-5
MOQ:	1 piezas
Precio:	US$ 29000
Detalles Del Embalaje:	Caja de madera
Condiciones De Pago:	T/T

Información detallada

Descripción de producto

Información detallada

Lugar de origen:

Cantón, China

Certificación:

CE, RoHS

Tamaño de PCB:

Máximo: 50X50m Mínimo: 1500X450mm

Presión del raspador:

0,5~0,7 kgf/cm2

Fuerza:

Tamaño de impresión:

Largo: 50-550, Ancho: 50-330

voltaje de trabajo:

Fase única 220V

Peso:

325 KILOGRAMOS

Capacidad de la fuente:

1000 unidad / mes

Descripción de producto

High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines.

1. Definition

A High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines. It is engineered to deposit solder paste onto PCB pads with micron-level accuracy (typically ±25µm to ±30µm), utilizing high-resolution CCD camera vision systems for precise alignment and closed-loop servo motor control for exceptional repeatability. Unlike entry-level or non-vision printers, this equipment is designed for fine-pitch components (down to 01005, 0.3mm pitch) and high-density PCB assemblies where printing accuracy directly impacts final product yield.

2. Description

Positioned at the very beginning of the SMT production line—immediately after the PCB loader and before the pick-and-place machine—this fully automated printer performs a highly controlled printing process:

Automatic Board Loading & Clamping: PCBs are automatically loaded via conveyor, with top-clamping or side-clamping mechanisms ensuring rigid fixation.
High-Precision Vision Alignment: Dual or single high-resolution CCD cameras capture fiducial marks on both the PCB and the stencil. Advanced pattern recognition algorithms calculate offsets in X, Y, and θ (rotation) axes, automatically adjusting the stencil or PCB table for perfect alignment—often achieving ±25µm alignment accuracy.
Closed-Loop Squeegee Control: Servo-driven squeegee heads apply controlled pressure, speed, and angle across the stencil. Closed-loop feedback systems maintain consistent printing parameters throughout the production run, compensating for paste viscosity changes.
Under-Stencil Cleaning: Integrated automatic cleaning systems (dry, wet, or vacuum) remove residual paste from the stencil underside after each print, preventing bridges and ensuring print quality.
Post-Print Inspection (Optional): Many high-precision models include 2D or 3D post-print inspection capabilities to immediately verify paste volume, height, and area, feeding data back to the printer for real-time process adjustment (closed-loop process control).

The entire process is fully automated, requiring minimal operator intervention, and is managed through an intuitive HMI (Human-Machine Interface) with recipe management for rapid product changeovers.

3. Key Features

Feature Category	Specific Features
Ultra-High Precision Alignment	±25µm to ±30µm printing accuracy; High-resolution CCD vision system (up to 12MP or higher); Automatic fiducial recognition & multi-point alignment
Exceptional Repeatability	Cpk ≥ 1.33 or ≥ 1.67 (industry gold standard); Precision-ground ball screws and linear guides; Temperature-compensated granite or cast-iron base for stability
Advanced Vision System	Top/bottom vision cameras; Automatic stencil mark & PCB fiducial detection; Pattern recognition algorithms; 2D/3D solder paste inspection integration
Closed-Loop Process Control	Real-time squeegee pressure, speed, and position feedback; Automatic paste viscosity compensation; Closed-loop stencil separation (peeling) control for optimal paste release
Automatic Cleaning System	Integrated dry/wet/vacuum under-stencil cleaning; Programmable cleaning frequency; Paperless or roll-type cleaning options
High Throughput	Cycle time typically 5–8 seconds per board (excluding cleaning); High-speed motion control; Rapid changeover (< 5 minutes)
Smart Software & Connectivity	Recipe management with barcode/QR code integration; SPC (Statistical Process Control) data reporting; MES (Manufacturing Execution System) connectivity; Remote monitoring & diagnostics (Industry 4.0 ready)
Robust Mechanical Construction	Heavy-duty cast iron or granite base; Vibration-dampening design; Precision linear guides with high-rigidity squeegee head
User-Friendly HMI	15"–21" touchscreen interface; Intuitive programming wizard; Real-time process monitoring dashboard; Multi-language support
Flexible Board Handling	Supports wide PCB size range (typically 50×50mm up to 600×600mm or larger); Automatic width adjustment; Warped board compensation capability

4. Application

High precision SMT automatic solder paste printers are essential in modern electronics manufacturing where first-pass yield and zero-defect goals are critical:

Consumer Electronics: Smartphones, tablets, laptops, smartwatches—where ultra-fine pitch components (0.3mm–0.4mm pitch) and high-density interconnect (HDI) boards are standard.
Automotive Electronics: ECU (Engine Control Units), ADAS sensors, BMS (Battery Management Systems), infotainment systems—requiring high reliability under harsh conditions.
Telecommunications: 5G base stations, routers, servers—with large, complex PCBs demanding precise paste deposition.
Medical Devices: Implantable devices, diagnostic equipment, monitoring systems—where zero defects are non-negotiable.
Aerospace & Defense: Avionics, radar systems, satellite electronics—requiring the highest levels of quality and traceability.
Industrial Electronics: PLCs, motor drives, power supplies—where long-term reliability is paramount.
Advanced Packaging: SiP (System-in-Package), PoP (Package-on-Package), flip-chip—where paste volume control is extremely sensitive.
High-Mix / High-Volume Production: Any SMT line aiming for Industry 4.0 smart factory integration, with full traceability and data-driven process optimization.

Applications:

For SMT PCB board production assembling full line machines.

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly 0

Etiquetas:

Impresora automática de la goma de la soldadura

Impresora de pantalla de soldadura con pasta

máquina de soldadura de plantillas

Detalles De Los Productos

Hogar > Productos >

Máquina de impresión de pasta de soldadura

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Todas Las Categorías

Máquina de la selección y del lugar

horno del flujo

Máquina de SMT AOI

Máquina de impresión de pasta de soldadura

Máquina SPI SMT

Línea de la máquina de SMT

Máquina de inserción automática

Máquina de soldadura por oleaje

Máquina del descargador del cargador de SMT

transportador del smt

Máquina para distribuir pegamento

Máquina de capa conformal

Máquina de curado de horno

Cortadora del PWB

maquinaria de la producción de la electrónica

Máquina de circuito impreso

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Nombre De La Marca:	HXT
Número De Modelo:	DH-5
MOQ:	1 piezas
Precio:	US$ 29000
Detalles Del Embalaje:	Caja de madera
Condiciones De Pago:	T/T

Información detallada

Descripción de producto

Información detallada

Lugar de origen:

Cantón, China

Nombre de la marca:

HXT

Certificación:

CE, RoHS

Número de modelo:

DH-5

Tamaño de PCB:

Máximo: 50X50m Mínimo: 1500X450mm

Presión del raspador:

0,5~0,7 kgf/cm2

Fuerza:

500W

Tamaño de impresión:

Largo: 50-550, Ancho: 50-330

voltaje de trabajo:

Fase única 220V

Peso:

325 KILOGRAMOS

Cantidad de orden mínima:

1 piezas

Precio:

US$ 29000

Detalles de empaquetado:

Caja de madera

Tiempo de entrega:

10-15 días

Condiciones de pago:

T/T

Capacidad de la fuente:

1000 unidad / mes

Descripción de producto

High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines.

1. Definition

2. Description

Automatic Board Loading & Clamping: PCBs are automatically loaded via conveyor, with top-clamping or side-clamping mechanisms ensuring rigid fixation.
High-Precision Vision Alignment: Dual or single high-resolution CCD cameras capture fiducial marks on both the PCB and the stencil. Advanced pattern recognition algorithms calculate offsets in X, Y, and θ (rotation) axes, automatically adjusting the stencil or PCB table for perfect alignment—often achieving ±25µm alignment accuracy.
Closed-Loop Squeegee Control: Servo-driven squeegee heads apply controlled pressure, speed, and angle across the stencil. Closed-loop feedback systems maintain consistent printing parameters throughout the production run, compensating for paste viscosity changes.
Under-Stencil Cleaning: Integrated automatic cleaning systems (dry, wet, or vacuum) remove residual paste from the stencil underside after each print, preventing bridges and ensuring print quality.
Post-Print Inspection (Optional): Many high-precision models include 2D or 3D post-print inspection capabilities to immediately verify paste volume, height, and area, feeding data back to the printer for real-time process adjustment (closed-loop process control).

The entire process is fully automated, requiring minimal operator intervention, and is managed through an intuitive HMI (Human-Machine Interface) with recipe management for rapid product changeovers.

3. Key Features

Feature Category	Specific Features
Ultra-High Precision Alignment	±25µm to ±30µm printing accuracy; High-resolution CCD vision system (up to 12MP or higher); Automatic fiducial recognition & multi-point alignment
Exceptional Repeatability	Cpk ≥ 1.33 or ≥ 1.67 (industry gold standard); Precision-ground ball screws and linear guides; Temperature-compensated granite or cast-iron base for stability
Advanced Vision System	Top/bottom vision cameras; Automatic stencil mark & PCB fiducial detection; Pattern recognition algorithms; 2D/3D solder paste inspection integration
Closed-Loop Process Control	Real-time squeegee pressure, speed, and position feedback; Automatic paste viscosity compensation; Closed-loop stencil separation (peeling) control for optimal paste release
Automatic Cleaning System	Integrated dry/wet/vacuum under-stencil cleaning; Programmable cleaning frequency; Paperless or roll-type cleaning options
High Throughput	Cycle time typically 5–8 seconds per board (excluding cleaning); High-speed motion control; Rapid changeover (< 5 minutes)
Smart Software & Connectivity	Recipe management with barcode/QR code integration; SPC (Statistical Process Control) data reporting; MES (Manufacturing Execution System) connectivity; Remote monitoring & diagnostics (Industry 4.0 ready)
Robust Mechanical Construction	Heavy-duty cast iron or granite base; Vibration-dampening design; Precision linear guides with high-rigidity squeegee head
User-Friendly HMI	15"–21" touchscreen interface; Intuitive programming wizard; Real-time process monitoring dashboard; Multi-language support
Flexible Board Handling	Supports wide PCB size range (typically 50×50mm up to 600×600mm or larger); Automatic width adjustment; Warped board compensation capability

4. Application

High precision SMT automatic solder paste printers are essential in modern electronics manufacturing where first-pass yield and zero-defect goals are critical:

Consumer Electronics: Smartphones, tablets, laptops, smartwatches—where ultra-fine pitch components (0.3mm–0.4mm pitch) and high-density interconnect (HDI) boards are standard.
Automotive Electronics: ECU (Engine Control Units), ADAS sensors, BMS (Battery Management Systems), infotainment systems—requiring high reliability under harsh conditions.
Telecommunications: 5G base stations, routers, servers—with large, complex PCBs demanding precise paste deposition.
Medical Devices: Implantable devices, diagnostic equipment, monitoring systems—where zero defects are non-negotiable.
Aerospace & Defense: Avionics, radar systems, satellite electronics—requiring the highest levels of quality and traceability.
Industrial Electronics: PLCs, motor drives, power supplies—where long-term reliability is paramount.
Advanced Packaging: SiP (System-in-Package), PoP (Package-on-Package), flip-chip—where paste volume control is extremely sensitive.
High-Mix / High-Volume Production: Any SMT line aiming for Industry 4.0 smart factory integration, with full traceability and data-driven process optimization.

Applications:

For SMT PCB board production assembling full line machines.

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly 0

Etiquetas: